Copper ink humidity sensors for packaging in development

Sara Ver-Bruggen - 12 May 2010

Swiss R&D agency ETH Zurich is developing a humidity sensor based on copper ink for commercial applications in packaging.

A team in ETH Zurich's functional materials group has succeeded in printing and curing the ink on flexible substrates, and now needs to decide whether to set up a company to commercialise the nanoparticle copper material as humidity sensors in packaging for monitoring food quality and storage.

Coating

The team is initially focusing on applications for the ink where high conductivity is not a requisite. The team has also fielded calls from coatings suppliers for credit card and automotive markets interested in using the inks for their metallic finish.

The group already has experience of setting up spinouts to leverage for a commercial strategy for the sensors and contacts with a food packaging supplier through one of these. A commercial partner that produces packaging or supplies the industry could help scale up the materials for producing the sensors and also integrate them into labels.

The humidity sensor application requires more work to enhance mechanical stability, which could take a further 12 months or more to complete.

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