Finnish project creates high-volume barrier process for plastic electronics packaging

Sara Ver-Bruggen - 27 Jun 2011


The Advanced Surface Technology Research Laboratory (Astral), a research unit of Lappeenranta University of Technology (LUT), is developing a roll-to-roll atomic layer deposition (ALD) process for several industrial applications.

Barrier film technologies for packaging could be applied to OLEDs and photovoltaics. Image: SamsungDeveloping an effective roll-to-roll process would provide cost-effective barrier solutions for many packaging applications - including production of fibre-based materials, polymer films and flexible packaging - as well as encapsulation processes for flexible electronic devices.

David Cameron, who manages Astral, says: 'Our immediate work is on moisture diffusion barriers for packaging applications, but we also have plans for work in diffusion barriers in OLEDs and also PVs, among others.'


Barrier

Working with Finnish partner Beneq, Astral has carried out breakthrough work into developing a roll-to-roll ALD process. Commercial ALD tools are designed for batch processing on stationary substrates. Roll-to-roll would exploit ALD technology's ability to produce nanoscale layers in a controlled manner to produce exceptionally dense, pinhole-free and completely conformable barrier coatings and films but on a high-volume process making it cost-effective.

Beneq recently announced that Astral is the first customer for its roll-to-roll ALD Web Coating System 500. The system will be ready for trial in early 2012, and builds on earlier collaboration between Beneq and Astral, where the lab produced moisture barriers on various paper and polymerised paper substrates with Beneq's TFS 200R equipment.

The roll-to-roll ALD barrier project, led by LUT, includes Tampere University of Technology (Paper Converting and Packaging Technology) and VTT Technical Research Centre of Finland. The project financiers are Teke, Stora Enso, UPM Raflatac and Innovia Films in the UK.

The next issue of +Plastic Electronics magazine is a nanotechnology special, with a series of articles on the latest technologies and emerging markets for printed nanoelectronics.
To sign up for your copy immediately, click the link below, contact publications@pira-international.com or visit our subscriptions page.

Documents and links

  • External Link External Link
  • External Link External Link
  • External Link External Link
  • External Link External Link

Related content