Organic electronics developers Plastic Logic, and ISORG are to unveil a new image sensor based on a plastic substrate, a world first, at the LOPE-C event in Munich, Germany.
The companies have co-developed the device, which offers the potential to minimise weight and power trade-offs and enhance optical design parameters for any systems with a digital imaging element.
The collaboration is based on the deposition of organic printed photodetectors (OPD), pioneered by ISORG, onto a plastic organic thin-film transistor (OTFT) backplane, developed by Plastic Logic, to create a flexible sensor with a 4x4 cm active area with a 375um pitch. The backplane design, production process and materials were optimised for the application by Plastic Logic to meet ISORG's requirements. The result is a flexible, transmissive backplane, representing a breakthrough in the manufacture of new large area image sensors and demonstrating the potential use of Plastic Logic's flexible transistor technology to move beyond plastic displays.
Indro Mukerjee, CEO Plastic Logic said: 'I am delighted that Plastic Logic can now demonstrate the far-reaching potential of the underlying technology. Our ability to create flexible, transmissive backplanes has led us not only to co-develop a flexible image sensor, but is also key to flexible OLED displays as well as unbreakable LCDs.'
The technology opens up the possibilities for a range of new applications, based around digital image sensing, including smart packaging and sensors for medical equipment and biomedical diagnostics, security and mobile commerce (user identification by fingerprint scanning), environmental, industrial, scanning surfaces and 3D interactive user interfaces for consumer electronics
The plastic image sensor will be shown on the ISORG stand at LOPE-C 2013, on 12-13 June.
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Documents and links
Plastic Logic's website with details of its Que e-reader and its various partnerships with publishers and content providers
Start-up set up to commercialise sensors based on organic electronics
The 2013 Large-area Organic and Printed Electronics Convention will take place on 11-13 June at Messe München, Munich, Germany
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