Researchers at Stanford University have developed a new method of attaching nanowire electronics to various surfaces, both flat and uneven.
The method involves coating the surface of the silicone wafer circuit with a thin layer of nickel, before fabricating the electronics. Then, when exposed to water, the silicone detaches, and the flexible electronics grip to anything they are exposed to. When the surface is reapplied to water, the electronics detach, ready to be used again, which should help reduce manufacturing costs, states a report by R&D.
The process can be carried out at room temperature, and has already been tested on materials including paper, textiles and even crumpled drinks cans.
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R&D report
Engineers invent easy on, easy off nanowire electronics
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