Researchers have developed a new high-performance thin-film capacitor, which could aid the transition to printed electronics.
A team from the International Centre for Materials Nanoarchitectonics and the National Institute for Material Science in Japan uses a new high-permittivity dielectric sheet stacked on an atomically thin SrRuO3 substrate. They are able to achieve high performance permittivity (160-300) with a film thickness of 5-15nm, reports PCB Design.
This latest research demonstrates simultaneous improvements in a number of material properties, including relative permittivity, lower loss and leakage current, and opens possibilities for flexible electronic products.
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PCB Design report
High-Performance Thin Film Boosts Electronics Research

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