New dates and location for dye solar cell event

Sara Ver-Bruggen - 15 Jul 2010

New dates and location have now been announced for the 4th International Conference on the Industrialisation of Dye Solar Cells (DSC-IC 2010). The Conference will be held November 1-4, 2010 in Colorado Springs, Colorado, US.

Due to logistical considerations, IntertechPira and lead sponsor Dyesol have changed the dates and location for the 4th DSC-IC.

The conference will now be held at the Cheyenne Mountain Resort in Colorado Springs. The programme will bring together scientists, engineers, industrialists, investors and others active in dye-sensitised solar cell (DSSC) technologies to discuss the latest innovations and applications and the progress of DSSC commercialisation.

Already confirmed to participate in this year's event is Michael Graetzel of École Polytechnique Fédérale de Lausanne, the father of third-generation, dye-sensitised solar cells. Other confirmed speakers include Art Frank, NREL; Gavin Tulloch of Dyesol; Toby Meyer of Solaronix; Peer Kirsch of Merck; Songyuan Dai of the Institute of Plasma Physics, Chinese Academy of Sciences and many others.

The programme will provide in-depth information on the materials, manufacturing and technology used in creating DSSCs, as well as the outlook for commercialisation.

Conference offering

Christopher Smith, senior conference producer at IntertechPira, states: 'Last year's event in Japan attracted over 300 industry leaders and we feel that the date change will allow us to accommodate our attendees and exhibitors more comfortably.

'We believe that the strong partnership with Dyesol, the leading supplier of third-generation solar technology, will make this event - one of the first exclusively on this topic to be held in North America - very successful this year.

'DSC-IC 2010 will bring together industry experts, manufacturers, researchers, investors, academics and end users, making it a must-attend event to learn about this exciting and fast-developing technology and network with the key players of the future.'

The conference will feature approximately 30 expert presentations assessing market trends, technical development and application-related advances, through presentations, question and answer sessions and panel discussions. Throughout the conference, there will be a number of hosted luncheons, breaks and receptions, which will be held in and around the exhibit area located outside the main conference room. Sponsorship and exhibition opportunities are available.

+Plastic Electronics will also be publishing a special issue on the DSC industry for distribution at the event, which will include advertising and advertorial opportunities. Email the magazine's editor for more information: sara.ver-bruggen@pira-international.com