The barrier layer - a critical passive component of flexible and organic electronic devices - is going through a re-evaluation as more options become available.
Until now, developers of flexible electronics have had very limited option when it comes to choosing an encapsulation technology to make their devices durable and robust.
An early mover in thin film-encapsulation equipment is Vitex Systems in California, the US, which developed its technology to make plastics more suitable substrates for organic electronics fabrication. The system produces alternate organic-inorganic layers to offer an effective encapsulant for OLED displays and other devices.
Testing
Other companies that have been working on the barrier challenge include German chemicals producer Wacker, which now supplies a silicone-based encapsulant for flexible solar cells that is compatible with roll-to-roll production.
Tera-Barrier Film, a spin-off from Singapore's Agency for Science, Technology and Research, is making rapid progress with its encapsulation technology. Earlier in 2011 the company attracted investment from Asian electronic materials supplier Kisco.
The barrier films are in testing with potential customers, to evaluate performance with flexible electronics. The company is also scaling up production.
R&D centres are committing to the development of encapsulation technologies too. The Georgia Institute of Technology in the US recently published a study into different organic electronic encapsulation technologies, including atomic layer deposition. In the UK Ossila, part of the Kroto Innovation Centre in Sheffield, has developed a light curable epoxy encapsulant.
Demand
Developers of flexible and organic electronics, including PowerFilm in the US and Heliatek in Germany, welcome the rate of encapsulation technology development.
Martin Pfeiffer, CTO of organic solar cell developer Heliatek, observes: 'Encapsulation is a challenge for flexible solar cells such as organic photovoltaics. We are seeing more contenders with encapsulation technologies coming to the market with encapsulation solutions though, which will make the market for this component more competitive.'
The latest issue of +Plastic Electronics magazine is an energy harvesting special, with a series of articles on the latest technologies and emerging markets for printed and organic solar, and other energy harvesting technologies.
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